2 lead plastic package ztb series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 06/09_a specifications subject to change without notic e page 1 product features: applications: low cost storage media compatible with leadfree processing home appliance microprocessors office automation * recommended external c1 and c2 values. ** 4.0 mm or 6.0 mm, contact ilsi america. the terminations of the ztb series ceramic resonator are pb fr ee. pb may be contained in the ceramic resonator element of this device and is exempted via item 7 of the rohs annex. this cera mic resonator series is considered rohs compliant. frequency 190 khz to 1600 khz esr (equivalent series resistance) see table below frequency tolerance @ 25 c 0.3% frequency stability over temperature 0.3% aging 0.3% max. for 10 years temperature operating -40 c to +85 c storage -40 c to +85 c standard part frequency tolerance esr c1 c2 "a" * "b" * "c" * "d" * "e" * code (khz) ( ? max.) (pf) (pf) (mm) (mm) (mm) (mm) (mm) ztb-a 190 to 249 1 khz 20 330* 470* 13.5 3.8 14.7 8.0 10.0 ztb-b 250 to 374 1 khz 20 220* 470* 11.0 3.8 9.3 7.0 7.7 ztb-c 375 to 429 2 khz 20 120* 470* 7.9 3.6 9.3 7.0 5.0 ztb-d 430 to 519 2 khz 20 100* 100* 7.0 3.5 9.0 ** 5.0 ztb-e 520 to 699 2 khz 30 100* 100* 7.0 3.5 9.0 ** 5.0 ztb-f 700 to 999 0.5% 30 100* 100* 5.2 2.8 6.8 3.5 2.5 ztb-g 1000 to 1600 0.5% 50 100* 100* 5.2 2.8 6.8 3.5 2.5 part number guide sample part number: ztb - g - 1000 part series part code frequency ztb - a b c d e f g - 1000 khz d e a b c 0.91 dimension units: mm
2 lead plastic package ztb series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 06/09_a specifications subject to change without notic e page 2 pb free solder reflow profile: typical circuit: *units are backward compatible with 240c reflow processes package information: msl = 1 termination = e1 (sn / cu / ag). environmental specifications thermal shock mil-std-883, method 1011, condition a moisture resistance mil-std-883, method 1004 mechanical shock mil-std-883, method 2002, condition b mechanical vibration mil-std-883, method 2007, condition a resistance to soldering heat j-std-020c, tabl e 5-2 pb-free devices (except 2 cycles max) hazardous substance pb-free / rohs / green compliant solderability jesd22-b102-d method 2 (preconditioning e) terminal strength mil-std-883, method 2004, test condition d gross leak mil-std-883, method 1014, condition c fine leak mil-std-883, method 1014, condition a2, r1=2x10-8 atm cc/s solvent resistance mil-std-202, method 215 marking line 1: ilsi line 2: frequency
|
